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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Temperaturecycling
【原文标准名称】:半导体器件.机械和气候试验方法.温度循环
【标准号】:BSEN60749-25-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-10-30
【实施或试行日期】:2003-10-30
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:
【摘要】:ThispartofIEC60749providesatestprocedurefordeterminingtheabilityofsemiconductordevicesandcomponentsand/orboardassembliestowithstandmechanicalstressesinducedbyalternatinghighandlowtemperatureextremes.Permanentchangesinelectricaland/orphysicalcharacteristicscanresultfromthesemechanicalstresses.ThistestmethodisingeneralaccordwithIEC60068-2-14but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.Thistestmethodappliestosingle,dualandtriplechambertemperaturecyclingandcoverscomponentandsolderinterconnectiontesting.Insinglechambercycling,theloadisplacedinastationarychamberandisheatedorcooledbyintroducinghot,ambientorcoldairintothechamber.Indualchambercycling,theloadisplacedonamovingplatformthatshuttlesbetweenstationarychambersmaintainedatfixedtemperatures.Intriplechambertemperaturecycling,theloadismovedbetweenthethreechambers.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:16P;A4
【正文语种】:英语